封装设计

1

FC/WB BGA Design

Impedance matching and   control

Thermal design and   verification

Process simulation (Molding, Reflow,   etc.)

2

MCM /SiP Design

Lumped parameter   elements extraction

Thermo-electrical   co-simulation

Thermo-mechanical simulation (TC, HTS)

3

WLCSP / Fan out WLP design

S parameters   extraction

Hot spot effect   evaluation

Humidity simulation

4

PoP/PiP design

TDR analysis

Thermal resistance   extraction

Hygro-mechanical simulation

5

FPC design

SI/PI analysis

 -

Thermo-mechanical-moisture simulation (HAST, 85°C/85RH, etc.)

6

2.5D Interposer Design

EMI analysis

 -

Drop test

7

Ceramic Design

IPD simulation

 -

 -

8

IPD Design

RF/MW System   simulation

 -

 -